2015 new style aluminum base copper clad laminate
We are specializes in a variety of aluminu m alloy products R & D, Our main producys are 2015 new style aluminum base copper clad laminate, aluminum alloy plate, strip, pipe, bar, coil, sheet, rod, tube, beam, angle, flange, wire, strip, channel, etc. more than one hundred kinds of alloys.
2015 new style aluminum base copper clad laminate, The high magnesium, aluminum alloy plate, sheet, aluminum alloy pre stretched aluminum alloy sheet series products are widely used in aerospace, military industry, electric locomotive, special vehicle, ship manufacturing, machinery processing, chemical industry, electric power, transportation, construction and decoration industries. With its enterprise capital strength, strong production, research and development ability.
We has been keeping sound cooperative relationship with many supplier and terminal clients across the world products are exported to USA, , Switzerland, North America, Middle East, Southeast Asia and other countries and regions.
"QUALITY IS SUPREME, REPUTATION GOES FIRST" is our objective. If you need 2015 new style aluminum base copper clad laminate, please feel free to send Email to [email protected], HM always welcome you!
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AL series Aluminum base copper clad laminate - ciahk.net
Imported aluminum base and copper foil, no-fiberglass, enduring 10min at 300℃ , Dielectric Constant 3.9 TTTT----200220000200 Thick copper clad laminate（4 oz ～ 10 oz）
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Copper Clad Laminates Aluminum Base Laminate - Magazines
Copper Clad Laminates Page 1 of 4 Issued:Jan-2010 Aluminum Base Laminate UL Approval: E214381 Version : Rev. 6 DatasheetDatasheets General Information Aluminum Thickness Aluminum style Dielectric Thickness X=A1: 1.6W/mK X=A2: 2.2W/mK Aluminum Plate Dielectric Layer Copper Foil .
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AL series Aluminum base copper clad laminate
AL series Aluminum base copper clad laminate ===== Class Type Features TTT-T---11111111 0 Imported aluminum base and copper foil, improvement of T-
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Aluminum Based Copper-clad Laminate Sheet
Aluminum Based Copper-clad Laminate Sheet Description and Application Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.
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Aluminum based copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has vey good heat sink, electromagnetic shielding and solder float.
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Copper Clad Laminates Aluminum Base Laminate
Copper Clad Laminates Page 1 of 4 Issued: Jul-2010 Version : Rev. A1 Aluminum Base Laminate UL Approval: E214381 DatasheetDatasheets General Information Ventec offers 4 types of Aluminum base laminate and prepreg, which have below features, ¾ VT-44A / VT-44A PP: Thermal conductivity -- 1.0W/mK, Ceramic Filled Suzhou New District Jiangsu, P
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Professional Manufacturer in Copper Clad Laminates
Copper Clad Laminates Page 1 of 1 Issued: Feb-2012 Ventec UL Approval: E214381. Aluminum Base Laminate. Version : Rev. A2. DatasheetDatasheet. s. 168 Xiang Yang Rd., Suzhou New District Jiangsu, P.R. China 215009 . Professional Manufacturer in Copper Clad Laminates.
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High thermal conductivity Aluminum base copper clad laminated sheets (AL base ccl) for PCB 1. Description: Aluminum base Copper Clad Laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very
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What are Aluminium based copper clad PCBs? This type of PCB is also called aluminum base, aluminium PCBs, aluminum clad or backed, insulated metal substrate (IMS), metal clad (MCPCB), or thermally conductive PCBs. For a typical metal based single sided PCB, the base laminate is made up of copper foil bonded to a thin, thermally conductive
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KW-ALE Aluminium Base Copper Clad Laminate
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Aluminum Base Copper Clad Laminate including . Feature: UL NO.:494951 thermal conductivity 1W/MK Excellent breakdown voltage, ≥3KV
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Aluminum base CCL（copper clad laminate) is a kind of raw material of metal PCB, which is consist of copper foil, thermal insulation layer and metal substrate, its structure in three layers: Circuit Layer : equivalent to ordinary PCB copper clad laminate, thickness of copper foil from loz to 10 oz.
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{X=A3: 3.0W/mK - Circuit Boards
Professional Manufacturer in Copper Clad Laminates General Information Ventec offers 4 types of Aluminum base laminate and prepreg, which have below features,
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In this paper, we have proposed a new chip-on-board package structure which has used the aluminum base copper clad laminate as the package substrate. The LED chips are directly bonded on the aluminum based and there has no insulation layer between the LED chips and the metal base.
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Clad metal combinations using stainless steel, aluminum, copper combinations, carbon core, Titanium & custom combinations. Industries served include aerospace, automotive, cookware, chemical, computer, electronics, environmental, telecommnications, house ware. 304 stainless steel clad to pure copper with a core of pure alloy aluminum.
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Description: PTFE Copper Clad Laminate is glass fabric impregnated with PTFE latex byprocessing under heat and pressure copper clad laminate with excellent performance in heat resistance and thermal mechanical strength.
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168 Xiang Yang Rd., Suzhou New District Jiangsu, P.R. China 215009 Professional Manufacturer in Copper Clad Laminates Page 1 of 1 Issued: Feb-2012 Ventec UL Approval: E214381. Aluminum Base Laminate. Ventec offers 3 types of Aluminum base laminate and
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What are Aluminium based copper clad PCBs? This type of PCB is also called aluminum base, aluminium PCBs, aluminum clad or backed, insulated metal substrate (IMS), metal clad (MCPCB), or thermally conductive PCBs. For a typical metal based single sided PCB, the base laminate is made up of copper foil bonded to a thin, thermally conductive
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Hangzhou Liansheng Insulation Co., Ltd was established in 1988, to be subject to Zhejiang Holley Group, is the enterprises which specialized in composite materials. Now our company has more than 600 employees, among them, professional and technical staff account for 40 %, and the existing production capacity of types of composite materials are
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NP-175FBH
COPPER CLAD LAMINATE DEPARTMENT NO. 201. TUNG HWA N. ROAD, TAIPEI, TAIWAN. Issued: 2015/01/01 New: 2015/11/12 4 Recommended press cycles: Suggestions: 1. Heating rate of material between 70 ℃ and 140 ℃ 1-3℃/min is acceptable. 1.5-2.5 ℃/min would be better. 2.
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The aluminum base copper clad laminate comprises sequentially a copper foil layer, an insulation layer and an aluminum plate layer, wherein, the insulation layer is prepared from an organic silicone resin composition, and the organic silicone resin composition comprises the following components in parts by weight: 100 parts of an organic
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